Password reset and notification emails are now sending correctly.
If you recently requested a password reset, please check your inbox (and spam folder just in case).
You can now reset your password and log in as normal.
Welcome back to PCHF, and thank you for your patience during our migration process!
β The PCHF Team
Welcome to PC Help Forum!
Youβre viewing our community as a guest.
That means you can browse posts, but canβt yet reply or start new topics.
Join us today β it's completely free!
As a member, you'll be able to:
β Get personalized tech support from trusted volunteers
π¦ Work one-on-one with our Malware Removal Specialists
I have an HP ZBook 15 G3 that has developed a problem. If picked up by the lower left hand corner the screen freezes. nothing responds. The only way to shut if down is to hold the power button down. I can restart and it will work fine until it is bumped or picked up on the left lower side. Looking for some trouble shooting ideas, please.
I have eliminated by battery by disconnecting and running on AC power.
No cracks visible anywhere.
I can cause some lines on the monitor by putting pressure on the left lower corner of the laptop. Seems like something in that area is the problem. I will remove the battery and see what is under there and if anything looks suspect.
This is a sign of BGA failure (Ball Grid Array failure).
It means that a soldering of a component is cracked/failed.
Was much more often seen around 1995-2005 when the transition from lead to non-lead soldering took place.
Non-led soldering requires higher temperatures and the tools available at that time could not -always- deliver.
HP submitted to us technical personnel -I was Senior Repair technician at HP Financial Services back then..-a rough test:
If a system exhibited intermittent failures, let the system run on a flat surface for some time and then lift it from a corner.
If anything happens, BGA failure is the prime suspect.
This is a sign of BGA failure (Ball Grid Array failure).
It means that a soldering of a component is cracked/failed.
Was much more often seen around 1995-2005 when the transition from lead to non-lead soldering took place.
Non-led soldering requires higher temperatures and the tools available at that time could not -always- deliver.
HP submitted to us technical personnel -I was Senior Repair technician at HP Financial Services back then..-a rough test:
If a system exhibited intermittent failures, let the system run on a flat surface for some time and then lift it from a corner.
If anything happens, BGA failure is the prime suspect.
So, how to find the problem area? Could it be isolated to that corner where I apply pressure to make the event happen?
We process personal data about users of our site, through the use of cookies and other technologies, to deliver our services, personalize advertising, and to analyze site activity. We may share certain information about our users with our advertising and analytics partners. For additional details, refer to our Privacy Policy.
By clicking "I AGREE" below, you agree to our Privacy Policy and our personal data processing and cookie practices as described therein. You also acknowledge that this forum may be hosted outside your country and you consent to the collection, storage, and processing of your data in the country where this forum is hosted.
Tweet
Comment